This is a partial list of the confirmed speakers that presented at the 2016 Lithography Workshop.
Please scroll the display below to view the full schedule.
| Session | Speaker | Affiliation | Title/Topic | |
| 1 | Plenary | Richard Schenker | Intel | Foundations for 3nm half-pitch patterning |
| Bill Arnold | ASML | EUV Lithography Ð Current Status and Future Prospects | ||
| Shinji Okazaki | Gigaphoton | Lithography: A key enabler for Moor's law scaling | ||
| 2 | Design and Device Technology | Vito Dai | Motivo | |
| Puneet Gupta | UCLA | |||
| Andrew Kahng | UCSD | |||
| Luigi Capodieci | KnotPrime | |||
| 3 | 193i extension and multiple patterning | Greg Rechtsteiner | Cymer | Spectral bandwidth effects on imaging, OPC |
| Bob Socha | ASML | Overlay and alignment (mark design, process effects on marks, mark vs device feature considerations) | ||
| Uwe D. Zeitner | Fraunhofer-Institut für Angewandte Optik und Feinmechanik (Germany) | Alternative high-resolution lithographic technologies for optical applications | ||
| Owa-san | Nikon | |||
| Carlos Fonseca | TEL | multi-patterning | ||
| Eric Bouche | ultratech | wafer flatness/overlay | ||
| Toshi "Tommy" Oga | Gigaphoton Inc. | The ArF Laser for the next generation cutting-edge ArFi lithography supporting green operations | ||
| 4 | EUV | Britt Turkot | Intel | EUVL insertion |
| Naoya Hayashi | DNP | EUV masks | ||
| Eric Hendrickx | Imec | EUV for N7 and N5 technology nodes | ||
| Nelson Felix | IBM | EUVL status | ||
| Hakaru Mizoguchi | Gigaphoton | High power sources for EUV extention | ||
| Norbert Koster | TNO | Contamination Control for EUV lithography at TNO | ||
| 5 | Maskless technology | Elmar Platzgummer | IMS Nanofabrication | Multi-Beam Mask Writer MBMW-101 for the 7nm node, and beyond |
| Hiroshi Matsumoto | Nuflare | Multi-beam mask writer MBM-1000 | ||
| Dan Meisburger | Maskless | The Maskless Lithography Revolution in PCB Production | ||
| Patrick Schiavone | Aselta | Why we should escape 1D-centric e-beam lithography flow | ||
| Ludovic Lattard / Laurent Pain | CEA-Leti | Latest results of mapper technology toward its industrialization ramp up | ||
| Marco Wieland | Mapper | MAPPER: High throughput maskless lithography | ||
| 6 | DSA | Ankit Vora | IBM | high-chi BCP materials |
| Marie Krysak | Intel | DSA insertion | ||
| Geert Vandenberghe | imec | DSA defectivity and implementation | ||
| Grant Willson | Univ Texas at Austin | DSA of Si-containing BCP materials | ||
| Andres Torres | Mentor Graphics | Design for DSA | ||
| Ricardo Ruiz | HGST | LWR Consideration for DSA | ||
| Mark Somervell | TEL | DSA processing | ||
| Geert Vandenberghe | imec | Templated DSA | ||
| Alex Liddle | NIST | Defectivity in Self-Assembled Structures | ||
| Mary Ann Hockey | Brewer Science, Inc. | Back End of the Line (BEOL) Strategy for Directed Self-Assembly | ||
| 7 | Advanced materials and processes for lithography | Michael Thompson | Cornell | Laser Spike Annealing of DSA Resists |
| Christopher Ober | Cornell | Update on the current state of EUV lithography | ||
| HIroki Nakagawa | JSR | auxiliary spin-on materials | ||
| Dierdre Olynick | LBNL | EUV resist fundamentals | ||
| Andrew Grenville | Inpria | Metal Oxide EUV resists | ||
| Ravi Kanjolia | EMD Performance Materials | Atomic Layer Deposition Materials: Key Enablers for New Processes | ||
| Sylvain Muckenhirn | Iris Versicolor llc | Etch transfer of 3D patterns and sub-15 nm half-pitch lines in Si using a variety of hard masks for NanoFrazor lithography | ||
| Kazuki Kasahara | Cornell Univ./JSR | Nanoparticle photoresist development status for EUV lithography | ||
| 8 | Computational Lithography | Nihar Mohanty | TEL Technology Center America, LLC | Patterning when variability rules the roost |
| Yuri Granik | Mentor Graphics | Gems and Jams of Inverse Lithography | ||
| Peng Liu | ASML Brion | Modeling Challenges in Negative Tone Lithography | ||
| Thomas Cecil | Synopsys | Model Based Assist Features | ||
| Eric Hendrickx | IMEC | EUV modeling with experimental verification | ||
| Shigeki Nojima | Toshiba | Machine learning for DFM applications | ||
| 9 | Patterning at 5nm and below | Mike Rieger | Synopsys | Lithography for advanced integrated devices |
| Bernd Geh | Zeiss | EUV with flexible illumination for advanced lithography | ||
| Martin Burkhardt | IBM | Will EUV be able to support low-k1 patterning? | ||
| Alexander Tritchkov | Mentor Graphics Corp | Use of Pixel-based Mask Optimization to Enable Patterning of Challenging 2D Design Patterns | ||
| 10 | Novel litho | Keita Sakai | Canon | Nanoimprint Wafer and Mask tool Status |
| Tatsuhiko Higashiki | Toshiba | Progress and challenges in Imprint Lithography | ||
| Robert R. McLeod | University of Colorado Boulder | Novel Multiple Patterning Lithography Far Beyond the Diffraction Limit | ||
| John Fourkas | University of Maryland | Progress Report on Photoresist Development for Multicolor Lithography | ||
| Naoya Hayashi | DNP | Imprint mask Infrastructure Readiness | ||
| S.V. Sreenivasan | University of Texas | Emerging nanopatterning opportunities in electronics, displays, and healthcare | ||
| Sylvain Muckenhirn | Iris Versicolor llc | NanoFrazor for 3D NIL 200mm master fabrication with single nanometer resolution | ||
| Steven R. J. Brueck | University of New Mexico | nm-Resolution Lithography using a GaN STM | ||
| 11 | Non-IC applications | Nikolaj Gadegaard | Univ. Glasgow | Cell and Tissue Engineering Based on Micro- and Nanolithography |
| Jean-Pierre Cloarec | Universitz de Lyon, Ecole Centrale de Lyon, Institut des Nanotechnologies de Lyon | Collective self-assembly of large sets of nanoparticles | ||
| F. Joseph Heremans | Univ. Chicago | Localizing Point Defects in Wide Bandgap Semiconductors | ||
| Jonilyn Yoder | MIT Lincoln Labs | Fabrication of High-Coherence Superconducting Qubits | ||
| Nicole Lindenmann | Nanoscribe GmbH | 3D Printing for Photonics Applications | ||
| Qi-Huo Wei | Kent State/Liquid Crystal Inst. | Projection Photopatterning Molecular Orientations in Liquid Crystals Using Novel Plasmonic Metamasks | ||
| Ryan Wicker | U. Texas El Paso | Printing MultifunctionalityUsing Additive Manufacturing | ||
| Anthony Megrant | Reducing microfabrication _induced loss in superconducting devices | |||
| Dave Pappas | NIST | Fabrication of Josephson junctions | ||
| 12 | Metrology | Hiroshi Fukuda | Hitachi High Technology | E-beam metrology, overcoming the limitation of scaling, variability, and productivity |
| Ben Bunday | SEMATECH | HVM metrology for 5 nm | ||
| Mike Adel | KT | Is imaging overlay metrology going away? | ||
| Vassilios Constantoudis | Demokritos | LER in DSA | ||
| Pieter Kruit | Delft/MAPPER | From dose statistics to line edge roughness | ||
| Rene Klaver | Heidenhain | |||
| Hamed Sadeghian | TNO | AFM | ||
| Sergey Babin | aBeam Technologies, Inc. | Fast comprehensive simulator of SEM images | ||
| Sergey Babin | aBeam Technologies, Inc. | 1.5 nm fabrication of test patterns for characterization of systems at nanoscale | ||
| Steven R. J. Brueck | University of New Mexico | Limits of optical scatterometry for nm-scale structures |