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Technical Chairs for 2010 Meeting:
The Technical Program chairs for the 2010 meeting are Dr. Michael Fritze (formally with DARPA and now with ISI) and Dr. Vivek Singh (Intel).
They will be assisted by the Technical Section Chairs listed below:
| EUV |
Bill Arnold |
ASML |
| Double Patterning |
Lars Liebmann |
IBM |
| Resists |
Cliff Henderson |
Georgia Tech |
| Computational Lithography |
Leo Pang |
Luminescent |
| DFM |
John Sturtevant |
Mentor Graphics |
| Self Assembly |
Paul Nealy |
University of Wisconsin |
| Maskless Lithography |
Chris Bevis |
KLA Tencor |
| Nanoimprint |
S.V. Sreenivasan |
Molecular Imprints |
| 3DIC |
Sitarum Arkalgud |
Sematech |
The Technical Program (speakers and titles) will be posted by August 15, 2010.
If you would like to contribute to the technical program, please feel free to submit an abstract to the Program chairs, Michael Fritze and Vivek Singh.
Technical Program for the 2010 Lithography Workshop
The Workshop is still accepting abstracts for Contributed and Poster Papers. To submit an abstract, please contact the technical program chairs:
Vivek Singh (vivek.singh@intel.com)
Michael Fritze (mfritze@isi.edu)
The 2010 Lithography Workshop will have great speakers from a variety of topics, as well as an exciting Panel Session to debate “EUV vs. Optical Extensions”. The current list of speakers includes:
Plenary Speakers:
Toshikazu Umatate, Vice President, Nikon
Tatsuhiko Higashiki, Senior Manager, Toshiba
EUV
Hans Meiling, ASML
Nigel Farrar, Cymer
Tim Crimmins, Intel
Double Patterning
Vincent Wiaux, IMEC
Andreas Wild, ENIAC
Kameshwar Poolla, IMPACT, Univ of California
Lars Liebmann, IBM
Carlos Fonseca, TEL
Chris Bencher, AMAT
Computational Lithography
James Blatchford, TI
Yuri Granik, Mentor Graphics
Leo Pang, Luminescent
Yu Cao, Brion
DFM
Luigi Capodieci, Global Foundries
David Pan, UT Austin
Andrew Kahng, UCSD
Andrezej Strojwas; CMU
Resists
Andrew Grenville, Inpria
Tom Wallow, Global Foundries
Cliff Henderson, Georgia Tech
Maskless
Serge Tedesco, LETI
Mark MacCord, KLA-Tencor
Hank Smith, Lumarray
Mike Smayling, Tela
Self Assembly
Joy Cheng, IBM
Paul Nealey, U Wisconsin
Karl K. Berggren MIT
Juan de Pablo, U Wisconsin
Nanoimprint
Naoya Hayashi, DNP
SV Sreenivasan, Molec. Imprints & UTexas
Lloyd Litt, Sematech
Carl Taussig, HP
3DIC
Sitaram, Arkulgud, Sematech
Wes Hansford, Mosis/ISI
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